Plasma Etch Trench Simulator

Set an RIE/ICP etch recipe and run it — the simulation executes on the ChipFoundryServices distributed compute pool and returns the predicted trench profile: depth, undercut, sidewall angle and aspect ratio. Reduced-order educational model. See also the compute-pool status.

Anisotropic (deep via) Isotropic (undercut) Tapered
Developer API — same simulation over HTTP (load-balanced across the pool): 
curl -X POST https://www.chipfoundryservices.com/edge/simulate \
  -H "Content-Type: application/json" \
  -d '{"mask_width_nm":100,"etch_time_s":90,"source_power_w":600,
       "bias_power_w":250,"pressure_mtorr":10,"passivation_ratio":0.80}'
Returns JSON with outputs (depth, undercut, sidewall angle, aspect ratio), the full profile point list, the serving node, and compute_ms.