CVD / ALD Deposition & Step-Coverage Simulator

Set a conformal-deposition recipe and run it — the simulation executes on the ChipFoundryServices distributed compute pool and returns the predicted film profile inside a trench: step coverage, conformality, breadloafing and keyhole void formation. Reduced-order educational model. See also the plasma-etch simulator and the compute-pool status.

ALD (conformal) PECVD (moderate) High-sticking (void)
Developer API — same simulation over HTTP (load-balanced across the pool): 
curl -X POST https://www.chipfoundryservices.com/edge/deposit \
  -H "Content-Type: application/json" \
  -d '{"trench_width_nm":100,"trench_depth_nm":600,
       "target_thickness_nm":30,"sticking_coeff":0.10}'
Returns JSON with outputs (conformality, step coverage, thicknesses, remaining opening, pinch-off flag), the full profile point list, the serving node, and compute_ms.