aluminum wire bonding
**Aluminum Wire Bonding** uses aluminum wire (typically 25-50μm diameter) for interconnecting die to package leads, favored for power devices and specific reliability requirements.
## What Is Aluminum Wire Bonding?
- **Material**: 99.99% pure aluminum or Al-1%Si alloy
- **Process**: Ultrasonic (US) wedge bonding at room temperature
- **Bond Type**: Wedge-wedge (no ball formation)
- **Applications**: Power modules, automotive, thick wire (>100μm)
## Why Aluminum Wire Bonding Matters
Unlike gold or copper, aluminum can be bonded at room temperature using pure ultrasonic energy—critical for temperature-sensitive devices and thick wire applications.
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**Aluminum vs. Gold/Copper Wire**:
| Property | Aluminum | Gold | Copper |
|----------|----------|------|--------|
| Bond temp | Room temp | 150-200°C | 150-200°C |
| Bond type | Wedge | Ball-stitch | Ball-stitch |
| Thick wire | Yes (>100μm) | Difficult | Difficult |
| Corrosion | Passivates | None | Requires protection |