bevel edge
**Bevel Edge** refers to the angled profile machined into wafer edges during manufacturing, typically at 15-22° angles to reduce chipping and improve handling.
## What Is a Bevel Edge?
- **Geometry**: Angled cut from wafer face to edge, 15-22° typical
- **Standard**: SEMI M1 specifies edge profile parameters
- **Purpose**: Reduce stress concentrations, ease film coating
- **Types**: Single bevel, double bevel, rounded bevel
## Why Bevel Edge Profile Matters
Proper bevel geometry affects epitaxial growth uniformity, photoresist edge coating, and mechanical handling robustness throughout processing.
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**SEMI M1 Edge Parameters**:
| Parameter | 200mm | 300mm |
|-----------|-------|-------|
| Bevel angle | 18-22° | 18-22° |
| Edge exclusion | 3mm | 2mm |
| Edge lip | <0.5μm | <0.5μm |
| Edge chips | None visible | None visible |
300mm wafers use tighter edge specifications due to higher processing costs per wafer.