binning by performance

**Binning by performance** is the **post-test classification of chips into product grades based on measured speed, power, and leakage characteristics** - it converts natural process variation into a structured pricing and product-segmentation strategy. **What Is Performance Binning?** - **Definition**: Assigning tested die to frequency or efficiency tiers according to validated operating limits. - **Typical Bin Axes**: Maximum stable clock, leakage current, voltage requirement, and thermal behavior. - **Operational Flow**: Wafer sort and final test data feed automated bin assignment logic. - **Business Role**: Enables one physical design to serve multiple market SKUs. **Why It Matters** - **Revenue Optimization**: Highest-performing die are sold into premium bins with better margin. - **Yield Monetization**: Near-miss die still create value in lower performance bins. - **Inventory Flexibility**: Bin mix can be tuned to demand across product segments. - **Feedback Loop**: Bin distribution exposes process drift and design sensitivity. - **Customer Targeting**: Different use cases receive matched power-performance products. **How Teams Run Binning Programs** - **Limit Definition**: Build bin thresholds from characterization, reliability, and market needs. - **Test Calibration**: Ensure measurement repeatability so bin boundaries remain trustworthy. - **Economic Tuning**: Periodically adjust thresholds to maximize total gross margin and shipment goals. Binning by performance is **a core bridge between silicon physics and product economics** - when executed well, it captures value across the full variation distribution instead of treating all non-premium die as loss.