center point runs
**Center point runs** are experimental runs performed at the **midpoint of all factor ranges** (the center of the design space) in a DOE. They serve multiple critical statistical purposes and are an essential component of well-designed factorial and response surface experiments.
**What Center Points Are**
In a $2^k$ factorial design where factors vary between low (−1) and high (+1) levels, center points are run at the **zero level (0)** for all factors simultaneously.
- Factor A: (Low + High) / 2
- Factor B: (Low + High) / 2
- etc.
Typically **3–5 center point replicates** are added to a factorial design.
**Why Center Points Are Important**
- **Curvature Detection**: The most important role. If the average response at the center point differs significantly from the average of the factorial points, this indicates **curvature** (nonlinear response) — meaning a linear model is inadequate and a response surface design (RSM) may be needed.
- If center point average ≈ factorial average → linear model is adequate.
- If center point average ≠ factorial average → curvature exists → consider RSM.
- **Pure Error Estimation**: Because center points are **replicated** (run multiple times at the same conditions), they provide a direct estimate of experimental error (pure error) — independent of any model.
- The variation among center point replicates reflects the inherent noise of the process.
- This pure error estimate is used to test the significance of main effects and interactions.
- **Process Insight**: The center point runs are at the nominal operating condition — they directly show process performance at the current baseline settings.
**Center Points in Practice**
- A typical $2^4$ factorial design (16 runs) might add **4 center points** = 20 total runs.
- Center points should be **randomized** with the factorial points — interspersed throughout the run order, not grouped.
- Good: runs 1,2,3(CP),4,5,6(CP),7,8(CP),... etc.
- This also provides monitoring of **time-related drift** during the experiment.
**Semiconductor Example**
- Etch DOE with factors: Power (200–400W), Pressure (20–50 mTorr), Gas Flow (50–100 sccm).
- Center point: Power=300W, Pressure=35 mTorr, Flow=75 sccm — run 3–4 times.
- If the etch rate at center points differs significantly from the average of the 8 factorial corner points, the etch rate has a nonlinear dependence on one or more factors.
Center points are the **cheapest and most informative** addition to any factorial DOE — they provide curvature detection, error estimation, and baseline verification for just a few extra runs.