compression molding

**Compression molding** is the **encapsulation method that cures molding compound by compressing material directly over package arrays in a closed mold** - it is widely used for thin packages and panel-level formats requiring lower flow-induced stress. **What Is Compression molding?** - **Definition**: Measured compound is placed on the panel or strip, then compressed to fill the mold area. - **Flow Profile**: Shorter flow distance reduces shear impact compared with transfer molding. - **Package Fit**: Common in fan-out and advanced thin-package manufacturing. - **Cure Control**: Temperature and pressure profile determine void behavior and final warpage. **Why Compression molding Matters** - **Wire Sweep Reduction**: Lower flow stress helps protect fine-pitch interconnect structures. - **Thin Form Factor**: Supports ultra-thin package requirements with better thickness control. - **Panel Compatibility**: Scales well for large-area molding processes. - **Yield Potential**: Can improve uniformity in advanced package architectures. - **Process Sensitivity**: Material dosing and mold-planarity errors can create voids or thickness variation. **How It Is Used in Practice** - **Material Dosing**: Control compound volume accurately to avoid overflow or underfill. - **Tool Flatness**: Maintain mold parallelism and cleanliness for uniform thickness. - **Warpage Monitoring**: Track post-mold warpage across panel area for process tuning. Compression molding is **a key encapsulation approach for advanced and thin semiconductor packages** - compression molding is most effective when dosing accuracy and mold mechanical control are tightly maintained.