forward bonding

**Forward Bonding** is a wire bonding sequence where the first bond (ball) is made on the die pad and the second bond (stitch) on the lead frame or substrate. ## What Is Forward Bonding? - **Sequence**: Ball bond on die → Loop → Stitch bond on lead - **Prevalence**: Standard method for >80% of wire bonding - **Advantage**: Ball bond's strength protects sensitive die pads - **Contrast**: Reverse bonding places first bond on substrate ## Why Forward Bonding Is Standard Ball bonds are mechanically stronger and more reliable than stitch bonds. Placing the ball on the critical die pad optimizes reliability. ```svg Forward Bonding Sequence:Step 1: Ball on Die Step 2: Form Loop Step 3: Stitch on Lead FAB ╭────╮ ╭────╮ │ │ │ │ │ ○ ← Ball ○ │ ○ ═══ ──────── ──────── │ ──────── ═══ Die Pad Die Pad │ Die Pad Lead ↓ Loop formation ``` **Forward vs. Reverse Bonding**: | Aspect | Forward | Reverse | |--------|---------|---------| | 1st bond location | Die pad | Lead frame | | Typical use | Standard | Stacked die, low loop | | Loop height | Normal | Can be lower | | Die pad stress | Lower | Higher |

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