package marking

**Package marking** is the process of permanently printing or engraving identification information onto the surface of a semiconductor package. This marking provides essential **traceability**, **identification**, and **compliance** information for every chip that ships from a facility. **What Gets Marked** - **Part Number**: The device's official model or product identifier. - **Date Code / Lot Code**: Manufacturing date and lot number for traceability (e.g., "YYWW" format — year and week). - **Company Logo**: The manufacturer's brand mark or name. - **Country of Origin**: Required for customs and trade compliance. - **Pin 1 Indicator**: A dot or notch marking pin 1 orientation for correct board assembly. - **Special Markings**: Military-grade parts, automotive-qualified parts, or RoHS compliance marks when applicable. **Marking Methods** - **Laser Marking**: The dominant method today — a **laser beam** ablates or discolors the package surface to create permanent, high-resolution text and graphics. Fast, clean, and requires no consumables. - **Ink Marking**: Older method using printed ink, still used for some package types. Less durable than laser marking. **Why It Matters** Accurate package marking is not just cosmetic — it is critical for **supply chain traceability**, **counterfeit detection**, **failure analysis**, and **regulatory compliance**. In automotive and aerospace applications, full lot traceability from marking back to wafer fabrication is mandatory. Incorrect or missing markings can result in **rejected shipments** and **compliance violations**.