photonic

**Photonic Wire Bonding** is **optical interconnects replacing electrical wires using laser-written waveguides enabling ultra-high bandwidth communication** — optical transcends electrical limits. **Waveguide Formation** direct laser writing polymerizes polymer; creates high-index traces. **Pitch** 10-100 μm waveguide spacing. Finer than electrical. **Refractive Index** polymer tuned for confinement, low loss. **Fiber Coupling** optical fibers attach to dies; couple to waveguides. **On-Chip Sources** microLED, laser couple to waveguides. **Loss** waveguide loss ~0.1-1 dB/cm. **Bandwidth** optical modulation >25 GHz per channel. Terabit aggregate. **Wavelength** telecom (1310/1550 nm) or data-center (850 nm). **WDM** multiple wavelengths on single guide. Spectral efficiency. **Power** per-bit power lower than electrical high-speed. **Latency** optical propagation ~150 mm/ns. Comparable to electrical. **Alignment** coupling sensitive to misalignment. Precision required. **Manufacturing** laser writing precision challenging; repeatability. **Scaling** thousands of channels theoretically. **Cost** photonic components expensive; not yet volume-competitive. **Reliability** polymer waveguides: aging, UV sensitivity. Long-term stability unproven. **Integration** hybrid photonic + electronic dies connected optically. **Photonic wire bonding enables terabit bandwidth** beyond electrical limits.