what process nodes

**Chip Foundry Services supports a comprehensive range of process nodes** from **180nm mature processes to 7nm leading-edge FinFET** — including specialty processes for analog, RF, power, MEMS, and image sensors with access to TSMC, Samsung, GlobalFoundries, and UMC foundries. **Available Process Nodes** **Mature Nodes (180nm-90nm) - High Volume, Low Cost**: **180nm Process**: - **Technology**: 6-metal CMOS, 1.8V/3.3V/5V I/O - **Applications**: MCU, power management, analog/mixed-signal, automotive - **Wafer Cost**: $1,000-$1,500 per 200mm wafer - **Mask Cost**: $50K-$80K - **Die per Wafer**: 2,000-8,000 depending on size - **Strengths**: Lowest cost, highest yield (>95%), proven reliability - **Foundries**: TSMC, UMC, SMIC, TowerJazz **130nm Process**: - **Technology**: 6-8 metal CMOS, 1.2V/1.8V/3.3V I/O, embedded Flash option - **Applications**: MCU, IoT, consumer, automotive, industrial - **Wafer Cost**: $1,500-$2,000 per 200mm wafer - **Mask Cost**: $80K-$120K - **Die per Wafer**: 3,000-12,000 depending on size - **Strengths**: Good cost/performance, mature, automotive-qualified - **Foundries**: TSMC, UMC, GlobalFoundries, SMIC **90nm Process**: - **Technology**: 7-9 metal CMOS, 1.0V/1.8V/3.3V I/O, low-k dielectric - **Applications**: Application processors, connectivity, consumer SoCs - **Wafer Cost**: $2,000-$2,500 per 200mm wafer - **Mask Cost**: $150K-$250K - **Die per Wafer**: 4,000-15,000 depending on size - **Strengths**: Good performance, moderate cost, high integration - **Foundries**: TSMC, UMC, GlobalFoundries, Samsung **Advanced Nodes (65nm-28nm) - Balanced Performance/Cost**: **65nm Process**: - **Technology**: 8-10 metal CMOS, 1.0V/1.8V/2.5V I/O, low-k, copper - **Applications**: Consumer SoCs, connectivity, automotive, industrial - **Wafer Cost**: $2,500-$3,500 per 300mm wafer - **Mask Cost**: $300K-$500K - **Die per Wafer**: 5,000-20,000 depending on size - **Strengths**: Sweet spot for cost/performance, widely available - **Foundries**: TSMC, UMC, GlobalFoundries, Samsung, SMIC **40nm Process**: - **Technology**: 9-11 metal CMOS, 1.1V core, low-k, high-k metal gate option - **Applications**: Mid-range SoCs, FPGA, networking, storage controllers - **Wafer Cost**: $3,000-$4,000 per 300mm wafer - **Mask Cost**: $500K-$1M - **Die per Wafer**: 6,000-25,000 depending on size - **Strengths**: Good performance/watt, mature process - **Foundries**: TSMC, UMC, GlobalFoundries, Samsung **28nm Process**: - **Technology**: 10-12 metal CMOS, 0.9V/1.0V core, high-k metal gate, multiple variants - **Variants**: 28nm HP (high performance), 28nm LP (low power), 28nm HPC+ (high performance computing) - **Applications**: High-end SoCs, AI accelerators, automotive, networking - **Wafer Cost**: $4,000-$5,000 per 300mm wafer - **Mask Cost**: $1M-$2M - **Die per Wafer**: 8,000-30,000 depending on size - **Strengths**: Excellent performance/watt, long-lived node, automotive-qualified - **Foundries**: TSMC, GlobalFoundries, Samsung, UMC **Leading-Edge Nodes (22nm-7nm) - Highest Performance**: **22nm Process**: - **Technology**: FinFET (tri-gate), 11-13 metal layers, high-k metal gate - **Applications**: High-performance computing, data center, AI - **Wafer Cost**: $5,000-$7,000 per 300mm wafer - **Mask Cost**: $2M-$4M - **Strengths**: FinFET advantages (better electrostatics, lower leakage) - **Foundries**: Intel (limited availability), GlobalFoundries (discontinued) **16nm/14nm Process**: - **Technology**: FinFET, 12-15 metal layers, EUV option for critical layers - **Applications**: Smartphones, high-performance computing, AI, networking - **Wafer Cost**: $6,000-$9,000 per 300mm wafer - **Mask Cost**: $3M-$5M - **Die per Wafer**: 10,000-40,000 depending on size - **Strengths**: High performance, good power efficiency, proven for volume - **Foundries**: TSMC (16nm), Samsung (14nm), GlobalFoundries (14nm, discontinued) **10nm Process**: - **Technology**: 2nd-gen FinFET, 13-16 metal layers, EUV for some layers - **Applications**: Smartphones, AI accelerators, high-performance computing - **Wafer Cost**: $9,000-$12,000 per 300mm wafer - **Mask Cost**: $5M-$8M - **Strengths**: 2× density vs 16nm, improved performance/watt - **Foundries**: TSMC (N10, N7), Samsung (10nm), Intel (10nm) **7nm Process**: - **Technology**: Advanced FinFET, 14-18 metal layers, EUV lithography - **Applications**: Flagship smartphones, data center CPUs/GPUs, AI accelerators - **Wafer Cost**: $10,000-$17,000 per 300mm wafer - **Mask Cost**: $5M-$10M - **Die per Wafer**: 15,000-50,000 depending on size - **Strengths**: Highest performance, best power efficiency, EUV simplifies manufacturing - **Foundries**: TSMC (N7, N7+, N6), Samsung (7nm LPP) **Specialty Process Technologies** **BCD (Bipolar-CMOS-DMOS)**: - **Nodes**: 180nm, 130nm, 90nm, 65nm - **Voltage**: 20V to 700V high-voltage devices - **Applications**: Power management ICs, motor drivers, LED drivers, automotive - **Features**: Bipolar for precision analog, CMOS for logic, DMOS for power - **Foundries**: TSMC, GlobalFoundries, TowerJazz, X-FAB **RF/Analog**: - **Nodes**: 180nm, 130nm, 90nm, 65nm, 40nm - **Features**: High-resistivity substrates, MIM capacitors, precision resistors, varactors - **Applications**: RF transceivers, wireless connectivity, radar, 5G - **Performance**: fT/fmax up to 300GHz (65nm RF) - **Foundries**: TSMC, GlobalFoundries, TowerJazz **CMOS Image Sensors (CIS)**: - **Nodes**: 180nm, 130nm, 90nm, 65nm, 45nm - **Features**: Backside illumination (BSI), stacked architecture, deep trench isolation - **Applications**: Smartphone cameras, automotive cameras, security, medical imaging - **Performance**: 1.0μm to 2.8μm pixel pitch - **Foundries**: TSMC, Samsung, TowerJazz, Sony **MEMS (Micro-Electro-Mechanical Systems)**: - **Nodes**: 180nm, 130nm with MEMS modules - **Features**: Deep RIE, wafer bonding, TSV, hermetic sealing - **Applications**: Accelerometers, gyroscopes, pressure sensors, microphones, inkjet - **Foundries**: TSMC, GlobalFoundries, TowerJazz, X-FAB, Bosch **SOI (Silicon-On-Insulator)**: - **Nodes**: 180nm, 130nm, 90nm, 65nm, 45nm, 28nm - **Features**: Reduced parasitic capacitance, radiation hardness, high-temperature operation - **Applications**: RF switches, automotive, aerospace, defense - **Types**: FD-SOI (fully-depleted), PD-SOI (partially-depleted) - **Foundries**: GlobalFoundries, Tower Jazz, Soitec **Process Selection Guidance** **Choose 180nm-130nm For**: - Cost-sensitive applications (<$1 per chip target) - Analog/mixed-signal heavy designs - Automotive and industrial (proven reliability) - Low-to-medium performance requirements (<100MHz) - High-voltage requirements (>5V) **Choose 90nm-65nm For**: - Balanced cost and performance - Medium complexity SoCs (100K-1M gates) - IoT and connectivity applications - Moderate performance (100-500MHz) - Good integration density **Choose 40nm-28nm For**: - High-performance SoCs (1M-10M gates) - Application processors, AI edge devices - Good performance/watt requirements - Advanced features (high-speed I/O, embedded memory) - Long product lifetime (28nm is long-lived node) **Choose 16nm-7nm For**: - Highest performance requirements (>2GHz) - Power-critical applications (mobile, battery-powered) - Maximum integration (10M+ gates) - Cutting-edge products (flagship smartphones, data center) - Willing to pay premium for best technology **Process Node Comparison** | Node | Wafer Cost | Mask Cost | Performance | Power | Density | Maturity | |------|------------|-----------|-------------|-------|---------|----------| | 180nm | $1.5K | $80K | Low | High | 1× | Mature | | 130nm | $2K | $120K | Low-Med | High | 2× | Mature | | 90nm | $2.5K | $250K | Medium | Medium | 4× | Mature | | 65nm | $3.5K | $500K | Med-High | Medium | 6× | Mature | | 40nm | $4K | $1M | High | Med-Low | 10× | Mature | | 28nm | $5K | $2M | High | Low | 15× | Mature | | 16/14nm | $9K | $5M | Very High | Very Low | 25× | Production | | 10nm | $12K | $8M | Very High | Very Low | 35× | Production | | 7nm | $17K | $10M | Highest | Lowest | 50× | Production | **Contact for Process Selection**: - **Email**: [email protected] - **Phone**: +1 (408) 555-0100 - **Service**: Free consultation to recommend optimal process node for your application Chip Foundry Services provides **access to the full spectrum of process technologies** from mature to leading-edge — our experts will help you select the optimal node balancing performance, power, cost, and time-to-market for your specific application.