what would you verify before releasing a new deposition process

Releasing a new deposition process = proving it's SAFE, REPEATABLE, and GOOD ENOUGH to ship. What you'd verify: 1) THICKNESS and UNIFORMITY across wafer and wafer-to-wafer (metrology — your strength). 2) Film PROPERTIES — stress, adhesion, composition/purity, step coverage (does it fill the feature right?). 3) DEFECTIVITY — particle counts within spec. 4) REPEATABILITY — runs the same over many wafers and over time (not just one good run; Lesson 38/60). 5) The PROCESS WINDOW — you know the limits within which it stays good. 6) DOCUMENTATION — the process is recorded so it can be reproduced. The one-line frame: 'Qualifying a process is proving it's repeatable within spec — thickness, uniformity, film properties, defects, and over time — and writing it down so anyone can reproduce it.' It shows real process-engineering judgment.