wire bond pull test

**Wire Bond Pull Test** is a **destructive mechanical test to evaluate the strength and quality of wire bonds** — performed by hooking a tool under the wire loop, pulling upward with a controlled force, and measuring the force at which the bond breaks. **What Is the Wire Bond Pull Test?** - **Standard**: MIL-STD-883 Method 2011, JEDEC JESD22-B114. - **Procedure**: A hook is placed under the wire at mid-span. Upward force is applied until failure. - **Failure Modes**: - **Bond Lift (Ball or Wedge)**: Weak intermetallic bond. - **Wire Break (Mid-Span)**: Good bonds, wire is the weakest link (desired failure mode). - **Cratering**: Bond pad or underlying silicon fractures (overprocessed bond). **Why It Matters** - **Process Control**: Monitors wire bond machine settings (force, ultrasonic energy, temperature). - **Material Qualification**: Validates new wire materials (Au, Cu, Ag-alloy). - **Minimum Force**: Specification defines minimum pull force based on wire diameter. **Wire Bond Pull Test** is **the tug-of-war for interconnects** — the standard mechanical assurance that wire bonds will survive the stresses of packaging and field operation.