Acoustic Microscopy is a non-destructive inspection technique that uses ultrasound waves to image internal features of packaged ICs — detecting delaminations, voids, cracks, and foreign materials hidden inside opaque packages without opening them.

What Is Acoustic Microscopy?

• Principle: Ultrasonic pulses are sent into the sample. Reflections from internal interfaces (material boundaries) are recorded.
• Medium: Requires a coupling medium (water) between the transducer and sample.
• Frequency: 15-300 MHz. Higher frequency = better resolution but less penetration depth.
• Modes: A-Scan (waveform), B-Scan (cross-section), C-Scan (plan-view image).

Why It Matters

• Non-Destructive: Inspects 100% of production without damaging devices.
• Delamination Detection: The primary tool for finding package delamination (die-to-mold compound, lead frame debonds).
• Incoming Inspection: Used by OEMs to verify component quality from suppliers.

Acoustic Microscopy is ultrasound for electronics — using sound waves to see inside sealed packages and detect hidden defects.