Active Interposer Design Integration is a silicon substrate containing embedded logic, routing resources, and power management circuits that actively orchestrates communication between multiple chiplets — Unlike passive interposers that merely provide routing pathways, active interposers incorporate intelligent components including routers, repeaters, protocol converters, and power distribution controllers. Functional Integration enables interposers to perform traffic steering, congestion management, thermal sensing, and dynamic load balancing across chiplet communications. Routing Architecture implements sophisticated switchfabrics with configurable pathways, support for multiple traffic classes with quality-of-service guarantees, and adaptive routing protocols responding to congestion conditions. Power Delivery Network integrates voltage regulators, power switches, and current sensing to provide independent power supplies to chiplets with independent voltage and frequency control. Thermal Management incorporates temperature sensors distributed across the interposer, local cooling control, and thermal throttling algorithms that balance performance and thermal dissipation. Protocol Support enables interposers to translate between different chiplet protocols, aggregate traffic from multiple sources, and implement sophisticated arbitration schemes. Synchronization Functions manage clock distribution across chiplet domains, phase alignment, and jitter filtering to maintain timing closure in complex multi-chiplet systems. Design Complexity requires advanced verification methodologies, thermal simulation frameworks, and power integrity analysis spanning multiple abstraction levels. Active Interposer Design Integration transforms interposers from passive substrates into intelligent orchestration platforms.