Aluminum Wire Bonding uses aluminum wire (typically 25-50μm diameter) for interconnecting die to package leads, favored for power devices and specific reliability requirements.

What Is Aluminum Wire Bonding?

• Material: 99.99% pure aluminum or Al-1%Si alloy
• Process: Ultrasonic (US) wedge bonding at room temperature
• Bond Type: Wedge-wedge (no ball formation)
• Applications: Power modules, automotive, thick wire (>100μm)

Why Aluminum Wire Bonding Matters

Unlike gold or copper, aluminum can be bonded at room temperature using pure ultrasonic energy—critical for temperature-sensitive devices and thick wire applications.

<svg viewBox="0 0 443 226" xmlns="http://www.w3.org/2000/svg" style="max-width:100%;height:auto" role="img"><rect x="0" y="0" width="443" height="226" rx="12" fill="#0d1117"/><g font-family="ui-monospace,SFMono-Regular,Menlo,Consolas,&quot;Liberation Mono&quot;,monospace" font-size="14"><text xml:space="preserve" x="20" y="31.7"><tspan fill="#c9d1d9">Al Wire Bond Process (Wedge-Wedge):</tspan></text><text xml:space="preserve" x="20" y="50.7"><tspan fill="#c9d1d9">1st Bond (wedge):        2nd Bond (wedge):</tspan></text><text xml:space="preserve" x="20" y="69.7"><tspan fill="#c9d1d9">    Tool                     Tool</tspan></text><text xml:space="preserve" x="20" y="88.7"><tspan fill="#c9d1d9">     </tspan><tspan fill="#6e7681">↓</tspan><tspan fill="#c9d1d9">                        </tspan><tspan fill="#6e7681">↓</tspan></text><text xml:space="preserve" x="20" y="107.7"><tspan fill="#c9d1d9">  </tspan><tspan fill="#6e7681">═══</tspan><tspan fill="#c9d1d9">╱╲</tspan><tspan fill="#6e7681">═══</tspan><tspan fill="#c9d1d9">                </tspan><tspan fill="#6e7681">═══</tspan><tspan fill="#c9d1d9">╱╲</tspan><tspan fill="#6e7681">═══</tspan></text><text xml:space="preserve" x="20" y="126.7"><tspan fill="#c9d1d9">   ╱    ╲                  ╱    ╲</tspan></text><text xml:space="preserve" x="20" y="145.7"><tspan fill="#c9d1d9">  </tspan><tspan fill="#6e7681">────────</tspan><tspan fill="#c9d1d9">                </tspan><tspan fill="#6e7681">────────</tspan></text><text xml:space="preserve" x="20" y="164.7"><tspan fill="#c9d1d9">   Die pad               Lead frame</tspan></text><text xml:space="preserve" x="20" y="183.7"></text><text xml:space="preserve" x="20" y="202.7"><tspan fill="#c9d1d9">Al forms flat wedge bonds (not balls like Au/Cu)</tspan></text></g></svg>

Aluminum vs. Gold/Copper Wire: