Atmospheric robots operate in normal atmosphere or nitrogen environments within the EFEM to transfer wafers at ambient pressure. Environment: Clean air or N2 at atmospheric pressure. Not vacuum compatible. Function: Transfer wafers from FOUPs to aligners to load locks. Ambient-side wafer handling. End effectors: Edge grip or vacuum for handling. Must not contaminate wafer surfaces. Speed: Optimized for throughput - typically several wafers per minute. Motion: SCARA or R-Theta configurations common. Multiple axes for reach and flexibility. Cleanroom compatible: Minimal particle generation, enclosed drive systems, cleanroom-grade lubricants. Comparison to vacuum robots: Simpler construction (no vacuum seals), faster motion (less concern about outgassing), standard motor options. Integration: Part of EFEM system. Interfaces with aligner, load ports, and load lock. Dual arm: Some robots have dual end effectors for swap operations - unload one wafer while loading another. Manufacturers: Brooks, RORZE, Hirata, JEL, Kawasaki.