Bevel Edge refers to the angled profile machined into wafer edges during manufacturing, typically at 15-22° angles to reduce chipping and improve handling.

What Is a Bevel Edge?

• Geometry: Angled cut from wafer face to edge, 15-22° typical
• Standard: SEMI M1 specifies edge profile parameters
• Purpose: Reduce stress concentrations, ease film coating
• Types: Single bevel, double bevel, rounded bevel

Why Bevel Edge Profile Matters

Proper bevel geometry affects epitaxial growth uniformity, photoresist edge coating, and mechanical handling robustness throughout processing.

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SEMI M1 Edge Parameters:

300mm wafers use tighter edge specifications due to higher processing costs per wafer.