Chip Foundry Services operates with significant manufacturing capacity including 50,000 wafer starts per month across 200mm and 300mm fabs — with 30,000 wafers/month on 200mm (180nm-90nm processes) and 20,000 wafers/month on 300mm (65nm-28nm processes) plus access to leading-edge capacity (16nm-7nm) through foundry partnerships with TSMC and Samsung. Our packaging facilities handle 10M units/month wire bond and 1M units/month flip chip with testing capacity of 10M units/month final test, supporting customers from prototyping (5 wafers) to high-volume production (10,000+ wafers/month) with capacity reservation options, long-term agreements, and flexible allocation to meet demand fluctuations and ensure on-time delivery.