Chiplet Assembly Process is bonding separately-fabricated dies (chiplets) into integrated system using fine-pitch interconnects — modular integration paradigm. Chiplet Partitioning divide SoC: compute on 5nm, I/O on 28nm. Optimize each technology node. Die-to-Die Interconnect micro-bumps (~2-5 μm diameter) at ~10-20 μm pitch. Micro-Bump Assembly flip-chip bonding connects chiplets. High-density. Substrate silicon interposer or organic substrate routes signals. Placement chiplets positioned precisely on substrate. Alignment ~1 μm tolerance. Redundancy defective chiplet replaced independently; improved yield vs. monolithic. Reusability chiplet library amortizes design cost. Time-to-Market parallel chiplet design; faster development. Performance Tradeoff longer inter-chiplet wires vs. shorter on-die. Latency overhead. Heat Distribution non-uniform power distribution. Thermal management optimized. Thermal Interface TIM between chiplets, heat spreader. Design Methodology partitioning critical. Bandwidth requirements drive architecture. Commercial AMD Ryzen (Zen cores + I/O), Intel (products), NVIDIA use chiplets. Heterogeneous Integration enables flexible modular system design with multiple process nodes.