Fab-wide control uses metrology data aggregated across all process tools and modules to maintain process targets, optimize yield, and enable holistic manufacturing management. Scope: Integrates data from lithography, etch, deposition, CMP, implant, and metrology across the entire fab. Central database: All tool data, metrology results, and lot history stored in centralized Manufacturing Execution System (MES) and data warehouse. Cross-module correlation: Identify relationships between upstream process variations and downstream device performance. Example: CVD thickness variation correlating with CMP non-uniformity and final parametric results. Tool matching: Ensure all tools of the same type produce equivalent results. Chamber matching for multi-chamber tools. Tool-to-tool offset monitoring and correction. Virtual metrology: Use tool sensor data and models to predict wafer-level results without physical measurement. Supplements inline metrology. Yield management: Correlate defect inspection data, parametric test results, and sort yield data to identify yield limiters. Excursion detection: Automated systems detect abnormal conditions across any tool or process, triggering alerts and lot holds. Advanced analytics: Machine learning and statistical methods applied to fab-wide data for predictive maintenance, recipe optimization, and yield prediction. R2R control: Run-to-run controllers across multiple process steps coordinated through fab-wide control architecture. Dashboard: Real-time visualization of fab health metrics, tool status, and yield indicators for management and engineering.