Forward Bonding is a wire bonding sequence where the first bond (ball) is made on the die pad and the second bond (stitch) on the lead frame or substrate.

What Is Forward Bonding?

• Sequence: Ball bond on die → Loop → Stitch bond on lead
• Prevalence: Standard method for >80% of wire bonding
• Advantage: Ball bond's strength protects sensitive die pads
• Contrast: Reverse bonding places first bond on substrate

Why Forward Bonding Is Standard

Ball bonds are mechanically stronger and more reliable than stitch bonds. Placing the ball on the critical die pad optimizes reliability.

<svg viewBox="0 0 620 207" xmlns="http://www.w3.org/2000/svg" style="max-width:100%;height:auto" role="img"><rect x="0" y="0" width="620" height="207" rx="12" fill="#0d1117"/><g font-family="ui-monospace,SFMono-Regular,Menlo,Consolas,&quot;Liberation Mono&quot;,monospace" font-size="14"><text xml:space="preserve" x="20" y="31.7"><tspan fill="#c9d1d9">Forward Bonding Sequence:</tspan></text><text xml:space="preserve" x="20" y="50.7"><tspan fill="#c9d1d9">Step 1: Ball on Die     Step 2: Form Loop      Step 3: Stitch on Lead</tspan></text><text xml:space="preserve" x="20" y="69.7"><tspan fill="#c9d1d9">     FAB                    ╭</tspan><tspan fill="#6e7681">────</tspan><tspan fill="#c9d1d9">╮                  ╭</tspan><tspan fill="#6e7681">────</tspan><tspan fill="#c9d1d9">╮</tspan></text><text xml:space="preserve" x="20" y="88.7"><tspan fill="#c9d1d9">      </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">                    </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">      </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">                </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">      </tspan><tspan fill="#6e7681">│</tspan></text><text xml:space="preserve" x="20" y="107.7"><tspan fill="#c9d1d9">      ○ </tspan><tspan fill="#6e7681">←</tspan><tspan fill="#c9d1d9"> Ball            ○       </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">               ○       </tspan><tspan fill="#6e7681">═══</tspan></text><text xml:space="preserve" x="20" y="126.7"><tspan fill="#c9d1d9">   </tspan><tspan fill="#6e7681">────────</tspan><tspan fill="#c9d1d9">            </tspan><tspan fill="#6e7681">────────</tspan><tspan fill="#c9d1d9">   </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">            </tspan><tspan fill="#6e7681">────────</tspan><tspan fill="#c9d1d9">  </tspan><tspan fill="#6e7681">═══</tspan></text><text xml:space="preserve" x="20" y="145.7"><tspan fill="#c9d1d9">   Die Pad             Die Pad    </tspan><tspan fill="#6e7681">│</tspan><tspan fill="#c9d1d9">            Die Pad   Lead</tspan></text><text xml:space="preserve" x="20" y="164.7"><tspan fill="#c9d1d9">                                  </tspan><tspan fill="#6e7681">↓</tspan></text><text xml:space="preserve" x="20" y="183.7"><tspan fill="#c9d1d9">                              Loop formation</tspan></text></g></svg>

Forward vs. Reverse Bonding: