Gold Wire Bonding is a semiconductor interconnect technique using thin gold wire (15-50μm diameter) to connect die bond pads to package lead frames or substrates.

What Is Gold Wire Bonding?

• Material: 99.99% pure gold (4N) or gold alloys
• Process: Thermosonic bonding at 150-220°C
• Bond Types: Ball bond (1st bond) and stitch bond (2nd bond)
• Speed: 15-25 wires per second on modern equipment

Why Gold Wire Bonding Matters

Gold has been the industry standard for decades due to excellent conductivity, corrosion resistance, and reliable ball formation.

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Gold vs. Copper Wire:

Gold remains preferred for high-reliability automotive and aerospace applications.