Macro inspection uses low-magnification full-wafer scanning — quickly detecting large-area defects, scratches, and contamination across entire wafers without the time required for high-resolution inspection.

What Is Macro Inspection?

• Definition: Low-magnification (1-10×) full-wafer inspection.
• Speed: Scan entire wafer in seconds to minutes.
• Purpose: Detect large defects, scratches, contamination quickly.

What Macro Inspection Detects: Scratches, large particles, wafer handling damage, edge chipping, backside contamination, gross pattern defects.

Why Macro Inspection?

• Speed: Much faster than high-resolution inspection.
• Coverage: Entire wafer scanned quickly.
• Cost: Lower cost than detailed inspection.
• Screening: Identify wafers needing detailed inspection.

Limitations: Cannot detect small defects, limited resolution, misses sub-micron issues.

Applications: Incoming wafer inspection, post-CMP screening, handling damage detection, contamination monitoring, quick quality check.

Tools: Macro inspection systems, optical scanners, automated visual inspection.

Macro inspection is quick screening tool — rapidly identifying gross defects and wafers needing detailed inspection, balancing speed with coverage.