MPW (Multi-Project Wafer) is a cost-sharing service where multiple chip designs from different customers share the same mask set and wafer — each customer's design occupies a portion of the reticle field, dramatically reducing the per-project cost of advanced node prototyping and small-volume production.

MPW Service Model

• Shared Reticle: Multiple designs are tiled on the same mask — each customer gets a fraction of the field.
• Die Allocation: Customers purchase a number of die sites — from 1mm² to full reticle field allocations.
• Fabrication: All designs are processed together through the same process flow — standard PDK.
• Delivery: Customers receive their specific die (diced, tested, or on-wafer) from the shared wafer.

Why It Matters

• Cost Reduction: Mask costs ($1M-$20M for advanced nodes) are shared among 10-50+ projects — enabling affordable prototyping.
• Access: Startups, universities, and small companies can access advanced nodes that would otherwise be prohibitively expensive.
• Iteration: Enables rapid design iteration — multiple tape-outs per year at manageable cost.

MPW is chip design carpooling — sharing mask and wafer costs among many projects for affordable access to advanced semiconductor fabrication.