Package marking is the process of permanently printing or engraving identification information onto the surface of a semiconductor package. This marking provides essential traceability, identification, and compliance information for every chip that ships from a facility.

What Gets Marked

• Part Number: The device's official model or product identifier.
• Date Code / Lot Code: Manufacturing date and lot number for traceability (e.g., "YYWW" format — year and week).
• Company Logo: The manufacturer's brand mark or name.
• Country of Origin: Required for customs and trade compliance.
• Pin 1 Indicator: A dot or notch marking pin 1 orientation for correct board assembly.
• Special Markings: Military-grade parts, automotive-qualified parts, or RoHS compliance marks when applicable.

Marking Methods

• Laser Marking: The dominant method today — a laser beam ablates or discolors the package surface to create permanent, high-resolution text and graphics. Fast, clean, and requires no consumables.
• Ink Marking: Older method using printed ink, still used for some package types. Less durable than laser marking.

Why It Matters

Accurate package marking is not just cosmetic — it is critical for supply chain traceability, counterfeit detection, failure analysis, and regulatory compliance. In automotive and aerospace applications, full lot traceability from marking back to wafer fabrication is mandatory. Incorrect or missing markings can result in rejected shipments and compliance violations.