Wafer handling robots are precision automated arms that pick and place wafers in semiconductor processing tools. Purpose: Transfer wafers between pods, aligners, load locks, and chambers without damage or contamination. End effector: The blade or paddle that contacts wafer. Edge grip, vacuum, Bernoulli, or electrostatic types. Minimal contact area. Materials: End effectors from ceramic, PEEK, quartz, or other clean materials compatible with process environment. Motion axes: Typically SCARA (Selective Compliance Articulated Robot Arm), R-Theta, or linear. 3-6 axes of motion. Precision: Sub-millimeter placement accuracy. Repeatable positioning essential. Clean handling: Robots designed for cleanroom - minimal particle generation, sealed bearings, clean lubricants. Speed: Optimize for throughput while maintaining precision and avoiding wafer damage. Vacuum robots: Robots in vacuum chambers (transfer chambers) for vacuum-compatible handling. Atmospheric robots: In EFEM, operate in clean air or N2 environment. Safety: Collision avoidance, interlock systems, controlled motion profiles.