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Semiconductor Manufacturing:
- Lithography: Photolithography, EUV, immersion, multi-patterning, OPC, resolution enhancement, mask making, pellicles, resists, exposure systems, ASML tools, overlay control, CD uniformity.
- Etching: Plasma etching, RIE, DRIE, ICP, CCP, etch chemistry, selectivity, anisotropy, sidewall profile, loading effects, microloading, aspect ratio dependent etching, endpoint detection.
- Deposition: CVD, PECVD, ALD, PVD, sputtering, evaporation, epitaxy, film properties, conformality, step coverage, stress, adhesion, thickness uniformity.
- CMP: Chemical mechanical planarization, slurry chemistry, pad design, pressure profiles, dishing, erosion, within-wafer uniformity, defects, endpoint detection.
- Doping: Ion implantation, diffusion, activation annealing, junction depth, dose control, channeling, damage, dopant profiles, rapid thermal annealing.
Advanced Process Technologies:
- FinFET: 3D transistor structure, fin formation, gate wrapping, short channel effects, 16nm/14nm/10nm/7nm nodes, Intel, TSMC, Samsung implementations.
- GAA (Gate-All-Around): Nanosheet/nanowire FETs, 3nm/2nm nodes, better electrostatics, inner spacer, stacking, TSMC A16, Samsung 3GAE, Intel 20A.
- EUV Lithography: 13.5nm wavelength, plasma source, multilayer mirrors, pellicles, resists, stochastic effects, high-NA EUV, 0.55 NA, anamorphic optics.
- 3D Integration: TSV, hybrid bonding, wafer-to-wafer, die-to-wafer, chiplets, UCIe, HBM, interposer, CoWoS, EMIB, Foveros.
Chip Design:
- RTL Design: Verilog, VHDL, SystemVerilog, FSM, pipelining, clock domain crossing, reset strategies, coding guidelines, lint checking, synthesis.
- Physical Design: Floor planning, power planning, placement, CTS, routing, optimization, timing closure, power optimization, signal integrity, IR drop, EM analysis.
- Verification: Testbench, UVM, assertions, coverage, constrained random, formal verification, equivalence checking, emulation, FPGA prototyping.
- DFT: Scan insertion, BIST, ATPG, fault models, test coverage, compression, diagnosis, yield learning, adaptive test, at-speed test.
AI & Machine Learning:
- Deep Learning: CNNs, RNNs, LSTMs, Transformers, attention mechanisms, ResNet, BERT, GPT, diffusion models, GANs, autoencoders.
- Training: Backpropagation, optimizers (SGD, Adam, AdamW), learning rate schedules, batch normalization, dropout, data augmentation, mixed precision.
- LLMs: Large language models, GPT-4, Claude, Gemini, Llama, tokenization, embeddings, attention, fine-tuning, LoRA, RLHF, instruction tuning.
- Inference: Quantization (INT8, INT4, FP8), pruning, distillation, KV cache, speculative decoding, continuous batching, vLLM, TensorRT.
GPU Computing:
- CUDA: Kernels, threads, blocks, grids, warps, memory hierarchy, shared memory, coalescing, occupancy, streams, events, unified memory.
- Optimization: Memory bandwidth, compute throughput, warp efficiency, bank conflicts, divergence, occupancy, instruction throughput, profiling.
- Hardware: NVIDIA architectures (Ampere, Hopper, Blackwell), AMD CDNA, tensor cores, RT cores, HBM, NVLink, PCIe, memory bandwidth.
Quality & Yield:
- SPC: Control charts, Cpk, Cp, process capability, X-bar R charts, EWMA, CUSUM, alarm rules, out-of-control conditions, root cause analysis.
- Yield Management: Sort yield, final test yield, defect density, Pareto analysis, yield models, learning curves, excursion management, OCAP.
- Six Sigma: DMAIC, DPMO, sigma levels, process capability, statistical analysis, DOE, hypothesis testing, regression analysis.
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