Chip Foundry Services offers comprehensive semiconductor solutions covering the entire chip lifecycle from design to production — including wafer fabrication, chip design, packaging, testing, and engineering support with advanced process technologies and expert technical guidance.

Complete Service Portfolio

1. Wafer Fabrication Services

Process Nodes Available:

• Mature Nodes: 180nm, 130nm, 90nm, 65nm (high-volume, cost-effective, proven reliability)
• Advanced Nodes: 40nm, 28nm, 22nm, 14nm, 10nm, 7nm (high-performance, low-power)
• Specialty Nodes: 180nm-65nm BCD, 180nm-130nm CMOS image sensors, 130nm-90nm MEMS

Process Technologies:

• Standard CMOS: 1.8V to 5V I/O, multiple metal layers (4-12 layers), embedded memory options
• BiCMOS: Combines bipolar and CMOS for high-speed analog and RF applications
• BCD: Bipolar-CMOS-DMOS for power management ICs, motor drivers, LED drivers
• RF/Analog: High-resistivity substrates, MIM capacitors, precision resistors, varactors
• High-Voltage: 20V to 700V processes for power management, automotive, industrial
• SOI (Silicon-On-Insulator): Reduced parasitic capacitance, radiation hardness, high-temperature operation

Production Capabilities:

• Wafer Sizes: 150mm (6"), 200mm (8"), 300mm (12")
• Monthly Capacity: 50,000 wafer starts per month across all nodes
• Lead Time: 6-8 weeks prototyping, 10-14 weeks production
• Minimum Order: 5 wafers (MPW), 25 wafers (dedicated run)

2. Chip Design Services

Full-Service ASIC Design:

• Specification: Requirements analysis, architecture definition, specification documentation
• RTL Design: Verilog/VHDL coding, synthesis, timing analysis, power analysis
• Verification: Testbench development, functional verification, coverage analysis, formal verification
• Physical Design: Floor planning, placement, CTS, routing, timing closure, signoff
• Tape-Out: GDSII generation, DRC/LVS verification, mask data preparation
• Timeline: 6-18 months depending on complexity
• Cost: $100K-$5M NRE depending on design size and complexity

Analog & Mixed-Signal Design:

• Analog Blocks: Op-amps, comparators, ADCs, DACs, PLLs, voltage references, LDOs
• RF Design: LNAs, PAs, mixers, VCOs, transceivers for 2.4GHz, 5GHz, sub-6GHz, mmWave
• Mixed-Signal Integration: Analog front-ends with digital control and signal processing
• Characterization: SPICE simulation, corner analysis, Monte Carlo, post-layout verification

IP Development & Licensing:

• Interface IP: USB 2.0/3.0, PCIe Gen3/4/5, DDR3/4/5, MIPI CSI/DSI, HDMI, DisplayPort
• Processor IP: ARM Cortex-M, RISC-V cores, DSP cores, custom processors
• Memory IP: SRAM, ROM, eFlash, eDRAM compilers
• Analog IP: PLLs, SerDes, ADCs, DACs, power management
• Licensing: Perpetual license, per-design license, royalty-based models

3. Packaging & Assembly Services

Wire Bond Packaging:

• Package Types: QFN (4x4mm to 12x12mm), QFP (32-256 pins), DIP, SOP, TSOP
• Wire Types: Gold (25μm, 20μm), copper (25μm), aluminum (25μm)
• Pitch: Down to 40μm pad pitch
• Throughput: 10M units/month
• Cost: $0.10-$0.50 per unit depending on package complexity

Flip Chip & Advanced Packaging:

• Flip Chip: C4 bumping, micro-bump (40μm pitch), copper pillar (100μm pitch)
• 2.5D Packaging: Silicon interposer, organic interposer, CoWoS-like solutions
• 3D Packaging: TSV, hybrid bonding, die stacking (2-8 layers)
• Fan-Out: eWLB, InFO-like fan-out wafer-level packaging
• Cost: $2-$20 per unit depending on complexity

Package Design Services:

• Substrate Design: Package substrate layout, signal integrity, power integrity
• Thermal Analysis: Thermal simulation, heat sink design, thermal management
• Mechanical Design: Package outline, ball map, assembly drawings
• Qualification: JEDEC qualification, reliability testing, failure analysis

4. Testing Services

Wafer Probe (Sort):

• Parametric Test: DC parameters, leakage, threshold voltages, capacitance
• Functional Test: Logic functionality, memory test, speed binning
• Equipment: Teradyne, Advantest, Keysight testers with 512-2048 channels
• Throughput: 100-500 wafers/day depending on test time
• Cost: $500-$5,000 per wafer depending on test complexity

Final Test:

• Package Test: Functional test, speed binning, temperature testing
• Burn-In: High-temperature operating life (HTOL) at 125°C-150°C for 48-168 hours
• Reliability: Temperature cycling (-55°C to +150°C), HAST, MSL testing
• Throughput: 1M-10M units/month
• Cost: $0.05-$0.50 per unit depending on test time

Characterization & Validation:

• Device Characterization: I-V curves, C-V curves, S-parameters, noise figure
• System Validation: Board-level testing, system integration, performance validation
• Reliability Qualification: JEDEC JESD47, AEC-Q100, MIL-STD-883

5. Engineering Support Services

Design for Manufacturing (DFM):

• Layout Analysis: DRC, LVS, antenna checking, density analysis, CMP modeling
• Yield Enhancement: Critical area analysis, redundancy insertion, process-aware design
• Optical Proximity Correction: OPC, PSM, SRAF insertion for sub-wavelength lithography
• Cost: Included in design services or $10K-$50K standalone

Design for Test (DFT):

• Scan Insertion: Full-scan, partial-scan, compression, X-bounding
• BIST: Memory BIST, logic BIST, analog BIST
• Boundary Scan: IEEE 1149.1 JTAG, IEEE 1149.6 AC-coupled
• Test Coverage: 95%+ stuck-at fault coverage, 90%+ transition fault coverage

Process Development:

• Custom Processes: Tailored process flows for specific applications
• Module Development: New device structures, novel materials, advanced integration
• Process Transfer: Technology transfer from R&D to production
• Cost: $500K-$5M depending on scope

Failure Analysis:

• Electrical FA: Curve tracing, IDDQ, timing analysis, functional debug
• Physical FA: Delayering, SEM, TEM, FIB, EDX, SIMS, X-ray, acoustic microscopy
• Root Cause Analysis: Systematic investigation, corrective actions, preventive measures
• Turnaround: 1-4 weeks depending on complexity
• Cost: $5K-$50K per analysis

Service Packages

Startup Package:

• MPW access (5-10 wafers)
• Basic design support
• Standard packaging
• Wafer sort and sample testing
• Cost: $50K-$200K total

Production Package:

• Dedicated wafer runs (25+ wafers)
• Full design services
• Advanced packaging options
• Complete testing and qualification
• Volume pricing and support
• Cost: $500K-$5M NRE + per-unit production costs

Enterprise Package:

• Multi-project support
• Dedicated engineering team
• Priority scheduling
• Custom process development
• Long-term partnership agreements
• Cost: Custom pricing based on volume and scope

How to Engage Our Services

1. Contact Us: Email [email protected] or call +1 (408) 555-0100 2. Consultation: Free technical consultation to understand your needs 3. Proposal: Detailed proposal with timeline, deliverables, and pricing 4. Contract: NDA, MSA, and project-specific SOW 5. Execution: Dedicated team assigned, regular updates, milestone reviews

Chip Foundry Services provides end-to-end semiconductor solutions — from concept to volume production with industry-leading expertise, advanced technologies, and comprehensive support to ensure your project success.