Chip Foundry Services operates globally with headquarters in Silicon Valley, manufacturing in Taiwan, and offices in Europe and Asia — providing 24/7 support and local presence to serve customers worldwide with design centers, fabrication facilities, and assembly/test operations strategically located near major technology hubs.
Global Headquarters - Silicon Valley, California, USA:
- Address: 2500 Technology Drive, Santa Clara, CA 95054, USA
- Phone: +1 (408) 555-0100 | Fax: +1 (408) 555-0199
- Services: Sales, ASIC design, technical support, business development
- Facilities: 50,000 sq ft design center, application lab, customer meeting rooms
- Team: 200+ engineers (design, verification, physical design, applications)
- Hours: Monday-Friday, 8 AM - 6 PM PST
- Visiting: By appointment, tours available with NDA
Manufacturing Center - Hsinchu, Taiwan:
- Address: No. 168, Science Park Road, Hsinchu Science Park, Taiwan 30078
- Phone: +886 3 555-0200 | Fax: +886 3 555-0299
- Services: Wafer fabrication, process engineering, quality assurance, metrology
- Facilities: 200mm fab (30K wafers/month), 300mm fab (20K wafers/month)
- Processes: 180nm to 28nm CMOS, BCD, RF, CIS, MEMS
- Team: 500+ engineers and technicians
- Hours: 24/7 operations
- Visiting: By appointment only, security clearance required
European Office - Munich, Germany:
- Address: Leopoldstraße 244, 80807 München, Germany
- Phone: +49 89 555-0300 | Fax: +49 89 555-0399
- Services: Sales, customer support, automotive design services
- Facilities: Design center, automotive qualification lab
- Focus: Automotive, industrial, medical device customers
- Team: 50+ engineers (automotive focus, ISO 26262, AEC-Q100)
- Hours: Monday-Friday, 9 AM - 5 PM CET
- Visiting: By appointment
Assembly & Test Center - Penang, Malaysia:
- Address: Bayan Lepas Free Industrial Zone, 11900 Penang, Malaysia
- Phone: +60 4 555-0400
- Services: Packaging, assembly, testing, failure analysis
- Facilities: Wire bond, flip chip, advanced packaging, test floor
- Capacity: 10M units/month wire bond, 1M units/month flip chip
- Team: 300+ engineers and operators
- Hours: 24/7 operations
- Visiting: By appointment only
Regional Sales Offices:
Japan Office - Tokyo:
- Address: Shibuya, Tokyo, Japan
- Phone: +81 3 555-0500
- Focus: Japanese customers, consumer electronics, automotive
China Office - Shanghai:
- Address: Pudong, Shanghai, China
- Phone: +86 21 555-0600
- Focus: Chinese customers, consumer, IoT, automotive
Korea Office - Seoul:
- Address: Gangnam, Seoul, South Korea
- Phone: +82 2 555-0700
- Focus: Korean customers, memory, display, mobile
India Office - Bangalore:
- Address: Electronic City, Bangalore, India
- Phone: +91 80 555-0800
- Focus: Indian customers, design services, engineering support
Contact: [email protected] | +1 (408) 555-0100
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