atmospheric robot

Atmospheric robots operate in normal atmosphere or nitrogen environments within the EFEM to transfer wafers at ambient pressure. **Environment**: Clean air or N2 at atmospheric pressure. Not vacuum compatible. **Function**: Transfer wafers from FOUPs to aligners to load locks. Ambient-side wafer handling. **End effectors**: Edge grip or vacuum for handling. Must not contaminate wafer surfaces. **Speed**: Optimized for throughput - typically several wafers per minute. **Motion**: SCARA or R-Theta configurations common. Multiple axes for reach and flexibility. **Cleanroom compatible**: Minimal particle generation, enclosed drive systems, cleanroom-grade lubricants. **Comparison to vacuum robots**: Simpler construction (no vacuum seals), faster motion (less concern about outgassing), standard motor options. **Integration**: Part of EFEM system. Interfaces with aligner, load ports, and load lock. **Dual arm**: Some robots have dual end effectors for swap operations - unload one wafer while loading another. **Manufacturers**: Brooks, RORZE, Hirata, JEL, Kawasaki.