bin split

**Bin split** is the **breakdown of dies by performance categories** — sorting chips into speed, power, or quality bins based on test results, enabling product differentiation and revenue optimization. **What Is Bin Split?** - **Definition**: Distribution of dies across performance bins. - **Purpose**: Product differentiation, pricing tiers, yield optimization. - **Bins**: Speed bins, power bins, quality grades. **Why Bin Split?** - **Performance Variation**: Not all chips perform identically. - **Market Segmentation**: Different customers need different performance. - **Revenue Optimization**: Sell faster chips at premium prices. - **Yield Maximization**: Sell slower chips at lower prices rather than scrap. **Bin Categories** **Speed Bins**: High-frequency (premium), mid-frequency (standard), low-frequency (value). **Power Bins**: Low-power (mobile), standard power, high-performance. **Quality Bins**: Grade A (perfect), Grade B (minor defects), Grade C (functional but limited). **Bin Split Analysis** - Measure performance distribution across wafer. - Define bin boundaries based on market requirements. - Calculate percentage in each bin. - Optimize pricing and positioning. **Applications**: Product portfolio management, pricing strategy, yield optimization, market segmentation. **Typical Distribution**: Normal distribution centered on typical corner, tails determine premium and value products. Bin split is **revenue optimization tool** — turning manufacturing variation into product portfolio and maximizing revenue from every wafer.