chiplet

**Chiplet Assembly Process** is **bonding separately-fabricated dies (chiplets) into integrated system using fine-pitch interconnects** — modular integration paradigm. **Chiplet Partitioning** divide SoC: compute on 5nm, I/O on 28nm. Optimize each technology node. **Die-to-Die Interconnect** micro-bumps (~2-5 μm diameter) at ~10-20 μm pitch. **Micro-Bump Assembly** flip-chip bonding connects chiplets. High-density. **Substrate** silicon interposer or organic substrate routes signals. **Placement** chiplets positioned precisely on substrate. Alignment ~1 μm tolerance. **Redundancy** defective chiplet replaced independently; improved yield vs. monolithic. **Reusability** chiplet library amortizes design cost. **Time-to-Market** parallel chiplet design; faster development. **Performance Tradeoff** longer inter-chiplet wires vs. shorter on-die. Latency overhead. **Heat Distribution** non-uniform power distribution. Thermal management optimized. **Thermal Interface** TIM between chiplets, heat spreader. **Design Methodology** partitioning critical. Bandwidth requirements drive architecture. **Commercial** AMD Ryzen (Zen cores + I/O), Intel (products), NVIDIA use chiplets. **Heterogeneous Integration enables flexible modular system design** with multiple process nodes.