hardware roadmap
**Semiconductor Hardware Roadmap**
**Process Node Evolution**
**Current and Future Nodes**
| Node | Status | Key Players | Transistor Type |
|------|--------|-------------|-----------------|
| 5nm | Production | TSMC, Samsung | FinFET |
| 3nm | Production | TSMC, Samsung | FinFET/GAA |
| 2nm | Development | TSMC 2025, Intel 2024 | GAA |
| 1.4nm | R&D | TSMC 2027-2028 | GAA |
| Below 1nm | Research | Exploring CFET, 2D materials | TBD |
**What "7nm", "5nm", "3nm" Mean Today**
Node names no longer correspond to physical transistor dimensions. They primarily indicate:
- **Density**: Transistors per mm²
- **Performance**: Speed improvements
- **Power**: Efficiency gains
**Transistor Architecture Evolution**
```
Planar → FinFET → Gate-All-Around (GAA) → CFET (future)
(16nm) (3nm/2nm) (sub-1nm)
```
**AI Chip Capacity**
**NVIDIA GPU Production**
| GPU | Process | Foundry | Supply Status |
|-----|---------|---------|---------------|
| H100 | TSMC 4N | TSMC | Supply-constrained |
| H200 | TSMC 4N | TSMC | Ramping |
| B100 | TSMC 4NP | TSMC | 2024 launch |
**AI Accelerator Landscape**
| Company | Chip | Status |
|---------|------|--------|
| NVIDIA | Blackwell | Upcoming |
| AMD | MI300X | Production |
| Intel | Gaudi 3 | Announced |
| Google | TPU v5 | Production |
| AWS | Trainium 2 | Coming 2024 |
| Cerebras | WSE-3 | Production |
| Groq | LPU | Production |
**Capacity Constraints**
- **Leading-edge capacity**: Limited to TSMC, Samsung, Intel
- **Advanced packaging**: CoWoS, HBM supply bottlenecks
- **HBM memory**: SK Hynix, Samsung, Micron; supply-constrained
- **Geopolitical factors**: US-China tensions affecting supply chains
**Data Center GPU Demand**
Estimated AI accelerator demand growing 30-40% annually, with supply lagging demand through 2025.