how do materials properties resistivity work function adhesion affect metal choice

Metal choice for a film is driven by MATERIAL PROPERTIES: 1) RESISTIVITY — lower resistivity (like copper) means less signal delay (RC, Lesson 72) and less heat; that's why copper replaced aluminum. 2) WORK FUNCTION — matters for gate/schottky contacts and for how a metal interfaces with a semiconductor; it sets barrier heights (your SBD content). 3) ADHESION — the metal must stick to what's under it, or you get delamination (Lesson 54/57); this is why liners/barriers exist. 4) Also: electromigration resistance, thermal stability, and how it reacts with silicon/dielectric. The one-line frame: 'I pick a metal for its electrical behavior, its work function at the junction, and whether it sticks — because resistivity, barrier height, and adhesion decide if the film works and survives.' As a chemical engineer you're well-placed to speak to materials. This connects your whole metal-deposition group.