macro inspection

**Macro inspection** uses **low-magnification full-wafer scanning** — quickly detecting large-area defects, scratches, and contamination across entire wafers without the time required for high-resolution inspection. **What Is Macro Inspection?** - **Definition**: Low-magnification (1-10×) full-wafer inspection. - **Speed**: Scan entire wafer in seconds to minutes. - **Purpose**: Detect large defects, scratches, contamination quickly. **What Macro Inspection Detects**: Scratches, large particles, wafer handling damage, edge chipping, backside contamination, gross pattern defects. **Why Macro Inspection?** - **Speed**: Much faster than high-resolution inspection. - **Coverage**: Entire wafer scanned quickly. - **Cost**: Lower cost than detailed inspection. - **Screening**: Identify wafers needing detailed inspection. **Limitations**: Cannot detect small defects, limited resolution, misses sub-micron issues. **Applications**: Incoming wafer inspection, post-CMP screening, handling damage detection, contamination monitoring, quick quality check. **Tools**: Macro inspection systems, optical scanners, automated visual inspection. Macro inspection is **quick screening tool** — rapidly identifying gross defects and wafers needing detailed inspection, balancing speed with coverage.