minimum order

**Minimum order quantities vary by service type**, with **flexible options from 5 wafers for prototyping to 25 wafers for production** — including Multi-Project Wafer (MPW) programs that allow startups and low-volume customers to access advanced processes affordably. **Wafer Fabrication Minimum Orders** **Multi-Project Wafer (MPW) - Lowest MOQ**: - **Minimum**: 5 wafers (shared run with other customers) - **Typical**: 5-20 wafers for prototyping - **Process Nodes**: 180nm, 130nm, 90nm, 65nm, 40nm, 28nm available - **Schedule**: Monthly or quarterly fixed runs - **Cost**: $5K-$100K depending on node and die size - **Best For**: Prototyping, proof-of-concept, low-volume production (<1,000 units) - **Lead Time**: 8-14 weeks from tape-out **Dedicated Production Runs**: - **Minimum**: 25 wafers per run - **Typical**: 25-100 wafers for initial production - **All Nodes**: 180nm to 7nm available - **Schedule**: Flexible, customer-specific timing - **Cost**: $25K-$425K per run depending on node - **Best For**: Production volumes (5K-500K units per run) - **Lead Time**: 8-16 weeks from order **Volume Production**: - **Minimum**: 100 wafers per run (volume pricing) - **Typical**: 100-1,000+ wafers per month - **Volume Discounts**: 10-30% cost reduction - **Capacity Reservation**: Guaranteed allocation - **Long-Term Agreements**: 1-3 year contracts with price protection - **Best For**: High-volume products (100K-10M units per year) **Packaging Minimum Orders** **Wire Bond Packaging**: - **Minimum**: 100 units (engineering samples) - **Typical**: 1,000-10,000 units per run - **Setup Cost**: $5K-$20K for new package type (one-time) - **Unit Cost**: $0.10-$0.60 depending on package complexity - **Lead Time**: 3-4 weeks after wafer delivery **Flip Chip Packaging**: - **Minimum**: 50 units (engineering samples) - **Typical**: 500-5,000 units per run - **Setup Cost**: $20K-$50K for new package (bumping + substrate) - **Unit Cost**: $1.00-$5.00 depending on complexity - **Lead Time**: 4-6 weeks after wafer delivery **Advanced Packaging (2.5D/3D)**: - **Minimum**: 20 units (engineering samples) - **Typical**: 100-1,000 units per run - **Setup Cost**: $100K-$500K (interposer design, TSV, tooling) - **Unit Cost**: $10-$80 depending on complexity - **Lead Time**: 6-10 weeks after wafer delivery **Testing Minimum Orders** **Wafer Sort**: - **Minimum**: 1 wafer (engineering evaluation) - **Typical**: 5-100 wafers per lot - **Setup Cost**: $20K-$100K for test program development (one-time) - **Per-Wafer Cost**: $500-$8,000 depending on test complexity - **No minimum for repeat orders** once test program developed **Final Test**: - **Minimum**: 100 units (engineering samples) - **Typical**: 1,000-100,000 units per lot - **Setup Cost**: $30K-$150K for test program development (one-time) - **Per-Unit Cost**: $0.05-$1.00 depending on test time - **No minimum for repeat orders** once test program developed **Design Services - No MOQ** **ASIC Design Services**: - **No Minimum**: Project-based pricing - **Scope**: From small IP blocks to complete SoCs - **Flexibility**: Scale team size based on project needs - **Payment**: Milestone-based, not quantity-based **IP Licensing**: - **No Minimum**: Per-design or perpetual license - **Usage**: Use in one or multiple designs - **Royalty Options**: Alternative to upfront license fee **Flexible Options for Low-Volume Customers** **MPW Programs**: - **Share Costs**: Split mask and wafer costs with other customers - **Cost Savings**: 5-10× cheaper than dedicated masks - **Example**: $50K MPW vs $500K dedicated masks for 28nm - **Tradeoff**: Fixed schedule, limited die quantity (typically 10-40 die) **Shuttle Services**: - **Ultra-Low Volume**: Get 5-10 packaged chips for $10K-$50K - **Process Nodes**: 180nm, 130nm, 90nm, 65nm, 40nm, 28nm - **Timeline**: 12-16 weeks from tape-out to packaged units - **Best For**: Research, proof-of-concept, investor demos **Consignment Inventory**: - **We Hold Stock**: We maintain inventory, ship as you need - **Minimum Production**: 100 wafers, but you take delivery in smaller batches - **Payment**: Pay for production upfront, no charge for storage (first 12 months) - **Flexibility**: Order 1,000 units monthly from 50,000 unit inventory **Volume Scaling Path** **Phase 1 - Prototype (5-25 wafers)**: - MPW or small dedicated run - 100-5,000 units delivered - Validate design, test market - Cost: $50K-$300K total **Phase 2 - Pilot Production (25-100 wafers)**: - Dedicated runs - 5,000-50,000 units delivered - Initial customer shipments - Cost: $200K-$1M per run **Phase 3 - Volume Production (100-1,000+ wafers)**: - Regular production runs - 50,000-500,000+ units per run - Volume pricing, capacity reservation - Cost: $500K-$10M+ per run **No MOQ Penalties** **Small Orders Welcome**: - No premium for small quantities (within minimums) - Same quality standards regardless of volume - Full technical support for all customers - Access to same processes and technologies **Startup Support**: - Flexible minimums for qualified startups - Payment terms aligned with funding - Technical mentorship included - Path to volume production **MOQ Comparison by Service** | Service | Minimum Order | Typical Order | Setup Cost | |---------|---------------|---------------|------------| | MPW Wafers | 5 wafers | 10-20 wafers | Shared | | Dedicated Wafers | 25 wafers | 50-200 wafers | Masks $50K-$10M | | Wire Bond Pkg | 100 units | 1K-10K units | $5K-$20K | | Flip Chip Pkg | 50 units | 500-5K units | $20K-$50K | | Adv Packaging | 20 units | 100-1K units | $100K-$500K | | Wafer Sort | 1 wafer | 5-100 wafers | $20K-$100K | | Final Test | 100 units | 1K-100K units | $30K-$150K | **How to Start Small and Scale** **Step 1 - Prototype with MPW**: - 5-10 wafers, 100-500 units - Validate design and market - Investment: $50K-$200K **Step 2 - Pilot with Small Dedicated Run**: - 25-50 wafers, 5K-25K units - Initial customer shipments - Investment: $200K-$500K **Step 3 - Production Ramp**: - 100+ wafers, 50K+ units - Volume pricing kicks in - Investment: $500K-$2M per run **Step 4 - High Volume**: - 500-1,000+ wafers per month - Long-term agreements, capacity reservation - Investment: $5M-$50M annual **Special Programs** **Academic/Research**: - **Minimum**: 1-2 wafers through university MPW programs - **Cost**: 50% discount on standard MPW pricing - **Purpose**: Research, education, publication **Startup Program**: - **Minimum**: 5 wafers MPW - **Flexibility**: Extended payment terms, milestone-based - **Support**: Technical mentorship, investor introductions **Fortune 500 Enterprise**: - **Minimum**: Negotiable based on relationship - **Flexibility**: Custom agreements, capacity reservation - **Support**: Dedicated team, priority scheduling **Contact for MOQ Discussion**: - **Email**: [email protected] - **Phone**: +1 (408) 555-0100 - **Question**: "What are the minimum order requirements for my project?" Chip Foundry Services offers **flexible minimum orders** to accommodate customers from startups to Fortune 500 companies — contact us to discuss the best approach for your volume requirements and budget.