multi-project wafer

**Yes, Multi-Project Wafer (MPW) is a core service** enabling **cost-effective prototyping by sharing wafer and mask costs** — with MPW programs available for 180nm ($5K-$10K per project), 130nm ($8K-$15K), 90nm ($15K-$25K), 65nm ($25K-$50K), 40nm ($40K-$80K), and 28nm ($80K-$200K) providing 5-20 die per customer depending on die size and reticle utilization with fixed schedules and fast turnaround. MPW schedule includes quarterly runs for mature nodes (180nm-90nm with tape-out deadlines in March, June, September, December), monthly runs for advanced nodes (65nm-28nm with tape-out deadlines every month), fixed tape-out deadlines (typically 8 weeks before fab start, strict deadlines), and delivery 10-14 weeks after tape-out (fabrication 8-10 weeks, dicing and shipping 2-4 weeks). MPW benefits include 5-10× lower cost than dedicated masks (share $500K mask cost among 10-20 customers, pay only $50K), low risk for prototyping (validate design before volume investment, minimal upfront cost), fast turnaround (fixed schedule, no minimum wafer quantity, predictable delivery), and flexibility (can do multiple MPW runs before committing to production, iterate design). MPW process includes reserve slot in upcoming MPW run (2-4 weeks before tape-out deadline, first-come first-served, limited slots), submit GDSII by tape-out deadline (strict deadline, late submissions wait for next run), we combine multiple designs on shared reticle (optimize placement, maximize die count), fabricate shared wafer (10-14 weeks, standard process flow), dice and deliver your die (5-20 die typical depending on size, bare die or packaged), and optional packaging and testing services (QFN, QFP, BGA packaging, basic testing, characterization). MPW limitations include fixed schedule (miss deadline, wait for next run, 1-3 months delay), limited die quantity (typically 5-20 die, not suitable for production >100 units), shared reticle (die size and placement constraints, may not be optimal location), and no process customization (standard process only, no custom modules or splits). MPW is ideal for prototyping and proof-of-concept (validate design, test functionality, demonstrate to investors), university research and education (student projects, research papers, thesis work, teaching), low-volume production (<1,000 units/year, niche applications, custom ASICs), and design validation before volume commitment (de-risk before expensive dedicated masks, iterate design). We've run 500+ MPW shuttles with 2,000+ customer designs successfully prototyped, supporting startups (50% of MPW customers), universities (30% of MPW customers, 100+ universities worldwide), and companies (20% of MPW customers, Fortune 500 to small businesses) with affordable access to advanced semiconductor processes. MPW pricing includes design slot reservation ($1K-$5K depending on node, reserves your slot), fabrication cost ($4K-$195K depending on node and die size, covers mask share and wafer share), optional packaging ($5-$50 per unit depending on package type), and optional testing ($10-$100 per unit depending on test complexity). MPW die allocation depends on die size (smaller die get more units, larger die get fewer units), reticle utilization (efficient packing maximizes die count), and customer priority (long-term customers, repeat customers get preference). Contact [email protected] or +1 (408) 555-0300 to reserve your slot in upcoming MPW run, check availability, or discuss die size and quantity — early reservation recommended as slots fill up 4-8 weeks before tape-out deadline.