multi-project wafer service

**MPW** (Multi-Project Wafer) is a **cost-sharing service where multiple chip designs from different customers share the same mask set and wafer** — each customer's design occupies a portion of the reticle field, dramatically reducing the per-project cost of advanced node prototyping and small-volume production. **MPW Service Model** - **Shared Reticle**: Multiple designs are tiled on the same mask — each customer gets a fraction of the field. - **Die Allocation**: Customers purchase a number of die sites — from 1mm² to full reticle field allocations. - **Fabrication**: All designs are processed together through the same process flow — standard PDK. - **Delivery**: Customers receive their specific die (diced, tested, or on-wafer) from the shared wafer. **Why It Matters** - **Cost Reduction**: Mask costs ($1M-$20M for advanced nodes) are shared among 10-50+ projects — enabling affordable prototyping. - **Access**: Startups, universities, and small companies can access advanced nodes that would otherwise be prohibitively expensive. - **Iteration**: Enables rapid design iteration — multiple tape-outs per year at manageable cost. **MPW** is **chip design carpooling** — sharing mask and wafer costs among many projects for affordable access to advanced semiconductor fabrication.