CMP Planarization & Dishing / Erosion Simulator

Set a chemical-mechanical polishing recipe and run it — the simulation executes on the ChipFoundryServices distributed compute pool and returns the Preston removal rate, the step-height planarization over time, and the over-polish defects (dishing in wide features, erosion in dense arrays). Reduced-order educational model. See also the plasma-etch, deposition and lithography simulators and the compute-pool status.

Oxide STI Cu damascene Over-polish
Step-height planarization vs polish time
Post-CMP surface cross-section — dishing (wide feature) & erosion (dense array)
Developer API — same simulation over HTTP (load-balanced across the pool): 
curl -X POST https://www.chipfoundryservices.com/edge/cmp \
  -H "Content-Type: application/json" \
  -d '{"down_pressure_kpa":20,"velocity_m_s":1.0,"polish_time_s":120,
       "initial_step_nm":500,"pattern_density":0.5,
       "feature_width_um":100,"selectivity":1.5}'
Returns JSON with outputs (removal rate, remaining step, planarization efficiency, dishing, erosion, verdict), the full profile (step-decay curve and post-CMP surface), the serving node, and compute_ms.