3D NAND
# Word-Line and Control-Gate Layering
## 9. 9. Word Line and Control Gate Layering
Each horizontal layer in a 3D NAND stack is built from an alternating pair of thin films: one film that eventually becomes a conductive word line, wrapping around every channel hole that passes through that layer, and one insulating film that separates it from the word line above and below. In the most common manufacturing approach, the stack is first deposited as alternating layers of silicon oxide and silicon nitride (a sacrificial nitride here, distinct in role from the charge-trap nitride described earlier, even though it is chemically the same material) — oxide for insulation, sacrificial nitride standing in for where the conductive word line will eventually go. After the channel holes are etched and the ONO/channel structure is formed inside them (the next two steps cover this etch and deposition sequence), a separate process removes the sacrificial nitride layers through narrow slits cut into the stack and replaces them with a conductive metal, typically tungsten, forming the actual word lines — a sequence often called the “replacement gate” or “gate-last” process. Every word line that results wraps fully around every channel hole at its layer, which is exactly the gate-all-around geometry described in step 7, repeated independently at each of the dozens or hundreds of layers the stack contains.