Semi E130.1

SEMI E130.1 defines the exact SECS-II message set for PSEM300 — the specific status-variable IDs (SVIDs) for chuck position and wafer-map progress, remote-command definitions for load/align/step/unload sequencing, and collection-event IDs (CEIDs) for probe-step completion and end-of-wafer events — rather than the general prober model E130 establishes. E130 says a 300 mm prober should expose a consistent wafer-handling geometry, coordinate reference frame, and load-align-step-unload sequence; E130.1 is the protocol-binding companion that fixes precisely which SECS-II messages, remote commands, and variable numbers carry that exchange, the same relationship nearly every SEMI equipment model has to its own ".1" binding — now applied to wafer probers instead of process tools.

SEMI E130 says: expose a consistent prober model (PSEM300)
Defined geometry and sequencing, but no fixed wire-level message set
SEMI E130.1 — SECS-II protocol binding for PSEM300Fixes the actual SVID/command/CEID numbers
Defined remote commands for load, align, step, and unload
Same command structure across every compliant prober
Defined SVIDs for chuck position/wafer-map progress, CEIDs for step completion
No vendor-specific interpretation of prober status
Host's GEM driver drives and reads any PSEM300-compliant prober identically
No per-vendor translation layer for probe-step sequencing or chuck status

The reason E130 needed its own protocol-binding companion is the same gap every equipment-model specialization closes the same way: a defined geometry and sequencing behavior in prose still leaves the actual remote-command structure and SVID/CEID numbering open to each prober vendor's own implementation, so two E130-compliant probers can step across a wafer map using different commands and variable IDs the host has to reconcile by hand. E130.1 removes that gap by fixing the SECS-II message set itself, so a fab's host software can write one GEM driver against E130.1's defined numbering scheme and have it work against any vendor's 300 mm prober, rather than maintaining a per-vendor mapping table for driving load/align/step/unload cycles and tracking chuck position.

SEMI E130.1 — Fixing PSEM300's Wire-Level Numbers wafer probers get the same binding guarantee as any other equipment model SEMI E130 (PSEM300) "Expose a consistent prober model" Geometry/sequencing, numbering left open SEMI E130.1 Fixed remote commands, SVID/CEID numbers Wire-level protocol binding Two E130-compliant probers can still step a wafer map differently E130.1 is what makes the load-align-step-unload sequence interchangeable

E130.1 completes PSEM300 the same way every ".1" protocol binding completes its base standard: E130 defines what a 300 mm prober and its host have to exchange, and E130.1 is the fixed SECS-II numbering scheme that makes that exchange identical across prober vendors, so a fab's host software never has to special-case a prober by brand to get usable chuck-position and wafer-map-progress data out of it.

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