Silicongate 1967 Step 13 Oxidation Doping Sequence Order
# Trace the Full Oxidation-and-Doping Sequence, in the Order It Actually Had to Happen
## 1. An Order That Was Not Arbitrary
Steps 1-7 of this series described gate-first deposition, patterning, self-aligned diffusion, and polysilicon doping as separate ideas; this step connects them into the single ordered sequence a real wafer actually traveled through, because the order itself carries engineering meaning each individual step did not need to state. Gate oxide grown first, polysilicon deposited second, gate patterned third, source/drain dopant driven in fourth using the gate as its own mask, and only then the heavy polysilicon doping anneal -- reversing any two of these steps breaks either the self-alignment this series' Step 4 depends on or the thermal budget Step 2 already established as the whole reason for choosing polysilicon.
## 2. What Reversing the Order Would Actually Break
Doping the polysilicon gate heavily before patterning it, for instance, would leave a conductive film across the whole wafer before the gate-length-defining etch, risking contamination of regions the etch is meant to clear entirely; driving in source/drain dopant before the gate is patterned would remove the self-alignment this series' Step 4 is built around, reintroducing exactly the alignment-margin problem Step 1 of this series exists to eliminate. The sequence is load-bearing, not incidental.