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Glossary

1,854 technical terms and definitions

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Die Shrink

A die shrink is the process of re-implementing an existing chip design on a smaller, more advanced manufacturing process node, reducing the physical size of the chip while…

Duplexer

A duplexer is a component that allows a radio device to transmit and receive signals simultaneously using a single shared antenna, by separating the outgoing and incoming signals…

Defect Density

Defect density is a measure of how many manufacturing defects occur per unit area of a wafer, used as a key indicator of a fabrication process's health and a critical input…

Dual Damascene

Dual damascene is an interconnect fabrication technique that etches both a via hole and its overlying metal trench into the insulating layer before a single metal fill, forming…