tsv process, tsv, business & strategy
TSV processes form via etch fill and reveal enabling 3D integration.
653 technical terms and definitions
TSV processes form via etch fill and reveal enabling 3D integration.
Long-term performance of TSV.
Electrical resistance of via.
Expose TSV tips after thinning.
Void formation in TSV metal.
Mechanical stress from TSV.
TTS converts text to speech. Neural TTS sounds natural. ElevenLabs, Bark, StyleTTS.
TTS converts text to speech. Modern models (XTTS, Bark) clone voices and express emotion. Use for voice interfaces.
Alternative to tape for through-hole.
Tucker decomposition factorizes tensors into core tensor and factor matrices.
Tucker decomposition factorizes tensors into core tensor and factor matrices for each mode.
Tucker decomposition for KG embeddings.
Tukey Honestly Significant Difference performs pairwise comparisons controlling family-wise error.
Robust M-estimator.
TuNAS optimizes architectures using one-shot methods with improved weight sharing and architecture sampling strategies.
Improved intermediate decoding.
W-filled contact or via.
Transistors using tunneling.
Quantum mechanical tunneling through barriers.
Turbomolecular pumps use high-speed rotors for high vacuum applications.
Time for ESD device to activate.
Manage conversation flow.
TVM automates optimization of deep learning models generating efficient code for diverse hardware.
Apache TVM compiles models for diverse hardware. Auto-tuning for performance. Edge to cloud.
Mirror-plane crystal defects.
Twin well processes implant separate n-wells and p-wells enabling complementary devices with optimized characteristics.
Form n-well and p-well separately.
Efficient spatial attention.
Wafer rotation angle for uniform implant.
Warning signal.
Map dopants in 2D.
Atomically thin semiconductors.
Two-flop synchronizers cascade registers reducing metastability probability exponentially.
Use phase change for heat removal.
Two-phase cooling exploits liquid-to-vapor phase change absorbing latent heat for enhanced thermal management.
Study excited state dynamics.
Two-sample t-tests compare means between independent groups.
Both bounds.
Anneal twice to control phase.
Separate spatial and temporal streams.
Two-way ANOVA analyzes effects of two factors and their interaction.
Detect trace metal contamination on wafer surface.
Statistical uncertainty.
Non-statistical uncertainty.
Type constraints restrict tokens to valid values for specific data types.
Type I errors reject true null hypotheses representing false positive findings.
Type II errors fail to reject false null hypotheses representing false negatives.
Infer types in dynamic languages.
Ensure outputs match type specifications.
Type-specific transformations apply different weight matrices to different node or edge types.