vector quantization, rag
Discretize continuous vectors.
244 technical terms and definitions
Discretize continuous vectors.
Vectorization uses SIMD instructions processing multiple data elements per instruction.
Use SIMD instructions.
Carriers temporarily exceed saturation velocity.
Carrier velocity saturates at high field.
Coordinate with suppliers.
Vendor qualification evaluates potential suppliers through audits capability assessments and trial productions before approval.
Evaluate LLM vendors on: quality, latency, cost, compliance, support. Have backup provider for resilience.
Allow pressure equalization.
Allow air escape.
venv creates Python virtual environments. Isolated dependencies.
Vercel deploys frontend apps easily. Next.js creators. Edge functions, AI SDK.
Verification models validate draft predictions accepting or rejecting tokens.
Check draft tokens with main model.
Check built right vs built right thing.
Check reasoning steps for correctness.
Track design revisions.
Vertex AI is Google Cloud ML platform. AutoML, custom training, serving. Gemini integration.
Learn from data with different features.
Vertical federated learning trains on different features of same samples across parties.
Vertical probes contact wafer pads perpendicularly using buckling beam or cobra-style tips for high-density fine-pitch testing.
Add more resources to existing machines.
Sub-nanosecond ESD testing.
Miniaturized outline package.
Voltage-current probe for plasma impedance.
Via arrays use multiple vias in parallel distributing current and improving electromigration lifetime.
Via chains connect metal layers through long strings of vias testing via yield and resistance.
Series of vias to test reliability.
Selective via removal for routing flexibility.
Place two vias instead of one.
Via electromigration is particularly critical due to current crowding at interfaces and reduced cross-sectional area accelerating failure.
Via formation creates vertical connections between metal layers through etching and filling processes maintaining electrical continuity.
Via poisoning occurs when etch residues block via bottoms increasing resistance and causing failures.
Multiple vias for reliability.
Via resistance contributes to overall interconnect resistance affecting signal delay and power delivery requiring optimization of size and material.
Electrical resistance of via.
Align vias vertically across layers.
Via-first dual damascene etches vias before trenches with single fill step.
Etch via before trench.
Form TSV before bonding.
Via-first TSVs are formed before transistor fabrication.
Order of via formation in dual damascene.
Form TSV after bonding.
Via-last TSVs are formed after wafer completion through substrate.
Form TSV during intermediate step.
Via-middle TSVs are formed during BEOL processing.
Vertical connection between metal layers.
Vibration analysis detects bearing and rotating equipment problems through frequency spectrum analysis.
Prevent mechanical disturbances.
Variational Intrinsic Control learns diverse skills through maximizing empowerment conditioned on skill embeddings.