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Chip Foundry Services - bridging Data, Algorithms, Compute and Communication. We help transform ideas into AI chips.
212 technical terms and definitions
Chip Foundry Services - bridging Data, Algorithms, Compute and Communication. We help transform ideas into AI chips.
Generate entire functions from docstrings.
Mask entire words instead of subwords.
Comprehensive ESD strategy.
Whole-page optimization designs entire recommendation surfaces jointly rather than filling slots independently.
Why-why analysis repeatedly asks why to drill down to root causes.
Parameter variation across single die.
Alternative stacked memory interface.
Special rules for wide power lines.
Wide-and-deep learning jointly trains wide linear models with deep neural networks for memorization and generalization in recommendations.
Wide-IO memory uses many parallel narrow interfaces for energy-efficient bandwidth.
Width multipliers scale channel counts uniformly adjusting model capacity.
Wigner D-matrices represent rotations in spherical harmonic bases enabling equivariant transformations.
Wilcoxon signed-rank test compares paired observations non-parametrically.
Win rate compares models through head-to-head preference judgments.
Wind power purchase agreements secure renewable energy from off-site wind farms.
Divide image into non-overlapping windows.
Winning tickets are sparse subnetworks with special initializations achieving dense network performance.
Subnetworks that achieve comparable performance.
Gender bias in coreference.
Test gender bias in coreference resolution.
Winograd convolution uses transform-based fast algorithm reducing multiplications for small kernels.
Commonsense reasoning test.
Large Winograd schema dataset.
WinoGrande tests pronoun resolution requiring world knowledge.
Wafers currently being processed in the fab.
Work-in-process caps limit inventory between operations preventing overproduction.
Control inventory levels.
Control and optimize work-in-progress inventory.
Minimize inventory while meeting targets.
Wire bond failure analysis examines bond strength intermetallic formation cratering and wire sweep using pull testing and cross-sectioning.
Measure bond strength.
Long-term bond performance.
Connect chip to package with wires.
Connect die pads to package leads with thin wires.
Wire pull testing measures bond strength by pulling wire bonds to failure characterizing interconnect reliability.
Wires drooping.
Wires displaced by flow.
Wires moving during molding.
How wire bonds fail.
Variation across single die.
Thickness variation across single wafer after CMP.
Variation across single wafer.
WizardLM uses Evol-Instruct for complex instructions. Strong coding variant.
WizardMath applies Evol-Instruct to math. Strong math performance.
NLI based on Winograd.
Alternative subword tokenization.
Tokenization used by BERT builds vocabulary of common subwords.
Work function metals tune transistor threshold by selecting materials with appropriate conduction band alignment.
Adjust threshold voltage via gate metal.