thermoelectric cooler, thermal management
Thermoelectric coolers use Peltier effect to actively pump heat enabling sub-ambient temperatures.
9,967 technical terms and definitions
Thermoelectric coolers use Peltier effect to actively pump heat enabling sub-ambient temperatures.
Thermographic inspection detects abnormal temperatures indicating electrical or mechanical problems.
Measure temperature via reflectance changes.
Theta-JA is junction-to-ambient thermal resistance encompassing package case and ambient contributions determining steady-state junction temperature.
Theta-JC quantifies thermal resistance between junction and case typically measured in degrees Celsius per watt for thermal characterization.
Thevenin termination uses two resistors to supply and ground providing matched impedance with bias.
Ensure even thickness.
Alternative thin QFP.
Thin and fine pitch.
Thinner version of SOP.
Manage wafer thinning accurately.
Thompson sampling for recommendations samples item quality from posterior distributions for exploration-exploitation balance.
Bayesian approach to exploration-exploitation.
Group of threads executing together.
Threads enable parallel execution on multiple cores. GIL limits Python. Use multiprocessing or native.
Dislocations extending through film.
AI helps threat modeling. Identify attack vectors.
Specific augmentation recipe for ViT.
3D reconstruction of doping.
Threshold voltage adjustment implants tune transistor turn-on voltage to meet circuit requirements.
Adjust Vt through doping or work function.
Vth differences across devices.
Insert leads into PCB holes.
Via through interposer.
Expose TSV ends after thinning.
Through-silicon vias create vertical electrical connections through silicon substrate.
Throughput accounting measures financial performance emphasizing throughput rather than traditional cost metrics.
Financial metrics for TOC.
Throughput dollar-days quantify financial impact of delayed shipments.
Number of tokens or requests processed per second.
Number of wafers processed per hour.
Merge models by resolving conflicts.
Process image in tiles.
Tiling strategies partition computations into cache-friendly blocks improving memory hierarchy utilization.
Wafer tilt to avoid channeling.
Thermal Interface Material fills microscopic air gaps between die and heat spreader or heat sink reducing thermal contact resistance.
Duration solder is molten.
Time buffers provide temporal protection allowing recovery from disruptions without impacting throughput.
Average time to generate each subsequent token.
Analyze sequential measurements over time.
Time series decomposition separates signals into trend seasonal and residual components for analysis and forecasting.
Describe temporal data in text.
Predict future behavior.
Time series analysis models temporal correlations in process data.
Time series split respects temporal order. No future leakage.
Time series forecasting predicts future values. LSTMs, Transformers. Finance, demand planning.
Latency before first output token appears.
Time to market measures duration from concept to product availability.
Speed of product launch.
Time to reach volume production.