wafer price,business
Cost charged by foundry per processed wafer.
9,967 technical terms and definitions
Cost charged by foundry per processed wafer.
Electrical test of dies on wafer before dicing.
Wafer sorters automatically classify and route wafers based on test results.
Classify wafers or dies by electrical test results.
Number of wafers entering production.
Measure mechanical stress in wafers using Raman or XRD.
Pre-treatment before critical process steps.
Wafer test data includes parametric electrical measurements and spatial coordinates used for yield analysis and defect detection.
Non-uniformity in wafer thickness across the wafer.
Reduce wafer thickness.
Reduce wafer thickness for 3D integration or packaging.
Bowing or distortion of wafer from stress or temperature.
CSP fabricated at wafer level.
Predict across-wafer variations.
Package at wafer level.
Approaches to testing dies on wafer.
Entire silicon wafer as single chip (Cerebras).
Adjust for each wafer.
Wafer is silicon disk with many dies. Each die is one chip. Yield = percentage of working dies.
Waiting waste occurs when resources idle between operations.
Idle time in process.
One-time approval for deviation.
Weights & Biases tracks experiments. Rich visualization, sweeps.
Backup partially ready.
Warm-starting neural architecture search initializes search with promising architectures from prior knowledge or searches.
Learning rate warmup period.
Gradual warmup for stability.
Gradually increase learning rate at start of training for stability.
Learning rate warmup starts low, increases gradually. Schedulers decay LR over time. Helps training stability and convergence.
Warning methods alert operators to potential errors enabling prevention.
Weighted Approximate-Rank Pairwise loss focuses on top-ranked items for ranking optimization.
GPU thread scheduling.
Warp (NVIDIA) or Wavefront (AMD) is group of threads executing together. Typically 32 threads. SIMT execution.
Bending due to thermal stress.
Warpage measurement quantifies package deformation using shadow moiré or laser profilometry.
Failed units returned under warranty.
Waste elimination removes non-value-adding activities improving efficiency and reducing cost.
Find non-value-adding activities.
Waste minimization reduces hazardous waste generation through process optimization and substitution.
Process and neutralize chemical waste before disposal.
Wastewater treatment removes contaminants from fab effluent through chemical neutralization precipitation filtration and biological processes.
Electrical tests on test structures to verify process.
Water footprint quantifies total water consumption and quality degradation from semiconductor manufacturing operations.
Water intensity measures water consumption per unit production quantifying manufacturing efficiency.
Water recycling systems treat and reuse process water reducing consumption through technologies like reverse osmosis and filtration.
Treat and reuse wastewater to reduce consumption.
Measure of water purity (18.2 MΩcdotcm for UPW).
Water reuse rate is percentage of water recycled for reuse reducing fresh water consumption.
Watermarking embeds detectable patterns in AI outputs. Helps identify AI-generated content.
Embed signatures in AI-generated text or images.