wire bonding, packaging
Connect chip to package with wires.
9,967 technical terms and definitions
Connect chip to package with wires.
Connect die pads to package leads with thin wires.
Wire pull testing measures bond strength by pulling wire bonds to failure characterizing interconnect reliability.
Wires drooping.
Wires displaced by flow.
Wires moving during molding.
How wire bonds fail.
Variation across single die.
Thickness variation across single wafer after CMP.
Variation across single wafer.
WizardLM uses Evol-Instruct for complex instructions. Strong coding variant.
WizardMath applies Evol-Instruct to math. Strong math performance.
NLI based on Winograd.
Alternative subword tokenization.
Tokenization used by BERT builds vocabulary of common subwords.
Work function metals tune transistor threshold by selecting materials with appropriate conduction band alignment.
Adjust threshold voltage via gate metal.
Variation in metal gate work function.
Work instructions provide detailed step-by-step procedures for tasks.
Monitor material in production.
Automate workflows with AI. Zapier, n8n, Make.
Working memory holds immediately relevant information for current task execution.
Standard used in daily operations.
A world model is a learned dynamics model that predicts future states and rewards enabling model-based planning and imagination-augmented agents.
Learn internal model of environment dynamics for planning and reasoning.
World-class OEE targets 85 percent representing international best practice benchmark.
OEE above 85%.
Worst-case analysis verifies functionality under extreme parameter combinations ensuring robustness.
Design for extreme conditions.
X-13-ARIMA-SEATS combines seasonal adjustment with ARIMA modeling for economic time series analysis.
Mean and range charts.
Mean and standard deviation.
General-purpose segmentation and caption model.
X-masking prevents unknowns from corrupting signature analysis in BIST.
X-propagation tracks unknown value propagation through logic.
Study electronic structure and bonding.
Map elemental composition.
See internal solder joints.
X-ray laminography produces cross-sectional images at specific depths revealing internal package structures.
Surface chemical analysis.
Spatially-resolved XPS.
Measure thickness density roughness.
Use X-rays for CD measurement.
X-ray computed tomography creates 3D reconstructions of package structures revealing internal defects like voids and cracks non-destructively.
X-state handling manages unknown values in simulation and test preventing masking.
Efficient 3D network family.
Chemical state and local structure.
Initialize considering fan-in and fan-out.
Extreme Deep Factorization Machine combines compressed interaction network with deep networks for feature interactions.
Xenon Focused Ion Beam uses heavier ions than gallium for rapid material removal in failure analysis with reduced redeposition.